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Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9987-y
Abstract: The Li–NiFe2O4 nanoparticles have been prepared via simple cost effective chemical co-precipitation method. X-ray diffraction analysis affirms the cubic spinel structure and particle size is ~ 32 nm. SEM and TEM analysis were revealed the needle shape…
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Keywords:
humidity sensitive;
efficient humidity;
nife2o4 nanoparticles;
sensitive electrical ... See more keywords
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Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2021.3054018
Abstract: This article presents six groups of dynamic temperature-sensitive electrical parameters (TSEPs) for the medium-voltage silicon carbide (SiC) and silicon (Si) devices. The physical mechanisms of the temperature dependence of these parameters are analyzed with the…
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Keywords:
voltage;
medium voltage;
dynamic temperature;
temperature ... See more keywords
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Published in 2018 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2017.2745442
Abstract: This paper proposes the adoption of the inherent emitter stray inductance $L_{{\rm{eE}}}$ in high-power insulated gate bipolar transistor modules as a new dynamic thermo-sensitive electrical parameter (d-TSEP). Furthermore, a family of 14 derived dynamic TSEP…
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Keywords:
high power;
emitter stray;
thermo sensitive;
stray inductance ... See more keywords
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Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2019.2950311
Abstract: The temperature-sensitive electrical parameters (TSEPs) have been used in silicon carbide (SiC) mosfets junction temperature measurement for over-temperature protection and condition monitoring. However, the device aging can affect the TSEPs and thus leads to false…
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Keywords:
electrical parameters;
sic mosfets;
temperature;
inline formula ... See more keywords