A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior
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DOI: 10.1109/tcpmt.2020.2978432
Abstract: Studies were conducted to validate from a metallurgical point of view whether a lower cost sequential plating approach to SnAg and SnAgCu (SAC) solder bumping is a suitable alternative to the conventional alloy plating process.… read more here.
Keywords: plating process; sequential plating; cost sequential; study low ... See more keywords