Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame
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DOI: 10.3390/polym17101301
Abstract: As the demand for smaller and more multifunctional integrated circuit (IC) products increases, system-in-package (SiP) has emerged as a key trend in IC encapsulation. However, the use of polymer-based materials such as epoxy molding compounds… read more here.
Keywords: shielding metal; integrated circuit; behavior void; metal frame ... See more keywords