FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
Sign Up to like & getrecommendations! Published in 2017 at "AIP Advances"
DOI: 10.1063/1.4978043
Abstract: The effects of thermal stress resulting from thermal cooling in copper/diamond/copper heat spreader is investigated using finite element method. A similar model of diamond/SiC heat spreader is compared without addition of interlayer. The effect of… read more here.
Keywords: diamond; sic heat; heat spreader; diamond sic ... See more keywords