Fabrication of AlN templates on SiC substrates by sputtering-deposition and high-temperature annealing
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Crystal Growth"
DOI: 10.1016/j.jcrysgro.2019.01.011
Abstract: Abstract High-quality AlN templates fabricated by sputtering-deposition and post-deposition high-temperature annealing have great potential for deep ultraviolet light-emitting device applications. In this work, we fabricated AlN films on 6H-SiC substrates by sputtering and face-to-face annealing… read more here.
Keywords: aln; sic substrates; sputtering deposition; aln templates ... See more keywords
Fabrication of vertically conducting near ultraviolet LEDs on SiC substrates
Sign Up to like & getrecommendations! Published in 2019 at "Superlattices and Microstructures"
DOI: 10.1016/j.spmi.2018.09.027
Abstract: Abstract In this work, GaN-based vertically conducting near ultraviolet light-emitting diodes (LEDs) were grown on n-SiC substrates by metal-organic chemical vapor deposition. 10 pairs or 20 pairs of Si-doped n-Al0.2Ga0.8N/n-GaN distributed Bragg reflectors (DBRs) were… read more here.
Keywords: ultraviolet leds; conducting near; near ultraviolet; sic substrates ... See more keywords
Spatial variation of lattice plane bending of 4H-SiC substrates
Sign Up to like & getrecommendations! Published in 2017 at "CrystEngComm"
DOI: 10.1039/c7ce00572e
Abstract: Basal plane bending of on- and off-axis 4H-SiC substrates was measured by high-resolution X-ray diffractometry (HRXRD). In order to evaluate basal plane bending properties in detail, line scans of 0004 reflection rocking curves were carried… read more here.
Keywords: sic substrates; basal plane; plane bending; silicon face ... See more keywords
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13071072
Abstract: Flip-chip microbump (μ-bump) bonding technology between indium phosphide (InP) and silicon carbide (SiC) substrates for a millimeter-wave (mmW) wireless communication application is demonstrated. The proposed process of flip-chip μ-bump bonding to achieve high-yield performance utilizes… read more here.
Keywords: flip chip; chip microbump; sic substrates; inp sic ... See more keywords