Preparation of hollow mesoporous silica/polyimide composite films and study of their properties
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DOI: 10.1002/pc.29506
Abstract: Constructing highâperformance polyimide (PI) films with low dielectric constant, excellent mechanical properties, hydrophobicity, and thermal stability is of great significance, but remains a great challenge. Herein, five PI films (labeled as P1, P2, P3, P4,… read more here.
Keywords: dielectric constant; mesoporous silica; composite films; silica polyimide ... See more keywords