Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading
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DOI: 10.1016/j.engfracmech.2019.01.030
Abstract: Abstract The anisotropy property of silicon is a basic property which has been discussed widely in the reliability assessment of electronic components. However, the effect of silicon anisotropy on the fracture behavior of through-silicon-via (TSV)… read more here.
Keywords: effect silicon; silicon; silicon anisotropy; crack ... See more keywords