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Published in 2017 at "Acta Mechanica"
DOI: 10.1007/s00707-015-1516-y
Abstract: AbstractDuring the thinning and machining processes, surface defects or cracks are easily induced on a silicon chip. The defects or cracks may cause stress concentration and become one of the failure sources for silicon chips.…
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Keywords:
surface;
silicon chip;
stress distribution;
chip ... See more keywords
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Published in 2020 at "IEEE Transactions on Terahertz Science and Technology"
DOI: 10.1109/tthz.2020.3022018
Abstract: We propose a waveguide directional coupler design with weak coupling using silicon-based suspended coupling microstrip probes and the split-block type of construction common in integrated millimeter wave components. WR4.0 coupler prototypes with standard UG-387 flanges…
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Keywords:
waveguide directional;
directional coupler;
chip based;
coupler ... See more keywords