Sign Up to like & get
recommendations!
1
Published in 2017 at "IEEE Journal of the Electron Devices Society"
DOI: 10.1109/jeds.2017.2724841
Abstract: Contact resistance and thermal degradation of metal-silicon contacts are major challenges in nanoscale CMOS as well as in power device applications. Titanium silicide (TiSi) is commonly used to establish low-barrier height contacts to silicon, in…
read more here.
Keywords:
barrier height;
carbon;
silicon contacts;
metal ... See more keywords