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Silicon Diode Uncooled FPA With Three-Dimensional Integrated CMOS Readout Circuits

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1 Published in 2019 at "IEEE Sensors Journal"

DOI: 10.1109/jsen.2018.2878098

Abstract: This paper reports the design, fabrication, and test of a 3-D integrated uncooled focal plane array (FPA) using monocrystalline silicon diodes as thermosensitive devices. The diode array is fabricated from the silicon device layer of… read more here.

Keywords: array; fpa; integration; silicon ... See more keywords