Effects of Mask Material on Lateral Undercut of Silicon Dry Etching
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DOI: 10.3390/mi14020306
Abstract: The silicon etching process is a core component of production in the semiconductor industry. Undercut is a nonideal effect in silicon dry etching. A reduced undercut is desired when preparing structures that demand a good… read more here.
Keywords: effect; mask; dry etching; silicon ... See more keywords