Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.
Sign Up to like & getrecommendations! Published in 2018 at "ACS nano"
DOI: 10.1021/acsnano.8b00180
Abstract: Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to… read more here.
Keywords: three dimensional; silicon electronic; electronic systems; dimensional silicon ... See more keywords
Silicon electronic–photonic integrated 25 Gb/s ring modulator transmitter with a built-in temperature controller
Sign Up to like & getrecommendations! Published in 2021 at "Photonics Research"
DOI: 10.1364/prj.413407
Abstract: We demonstrate a silicon electronic–photonic integrated 25 Gb/s nonreturn-to-zero transmitter that includes driver circuits, depletion-type Si ring modulator, Ge photodetector, temperature sensor, on-chip heater, and temperature controller, all monolithically integrated on a 0.25 μm photonic BiCMOS technology… read more here.
Keywords: silicon electronic; photonic integrated; temperature; ring modulator ... See more keywords