Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect
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DOI: 10.1016/j.acme.2017.03.010
Abstract: Abstract Grinding process of monocrystalline silicon easily leads to fractured surfaces, therefore an analytical model of the ground silicon surface is presented. In the model, the ductile-regime effect is considered by determining grain-workpiece interaction mode… read more here.
Keywords: topography; monocrystalline silicon; ductile regime; regime effect ... See more keywords