Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2779838
Abstract: In this paper, for the first time, we designed and analyzed channels between a graphic processing unit and memory in a silicon interposer for a 3-D stacked high bandwidth memory (HBM). We thoroughly analyzed and… read more here.
Keywords: signal integrity; bandwidth memory; silicon interposer; memory ... See more keywords
Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2917292
Abstract: Novel silicon interposer package solution is proposed for monolithic microwave integrated circuit (MMIC) heterogeneous integration. The GaAs/InP MMICs are integrated into the high-resistance silicon interposer by the gold ball flip-chip technique. Then, the whole silicon… read more here.
Keywords: interposer package; silicon; ball flip; silicon interposer ... See more keywords
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Circuits and Systems I: Regular Papers"
DOI: 10.1109/tcsi.2024.3419579
Abstract: Silicon interposer re-usage is drawing attention for cost-effective multi-chiplet integrated systems. To address the communication awareness of inter/off-chiplet interconnect, the paper proposes a field-programmable interconnect fabric and develops its corresponding automatic physical integration tool. The… read more here.
Keywords: integration; field programmable; chiplet; silicon interposer ... See more keywords
A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13071138
Abstract: High-speed digital microsystems has emerged as one of the most important solutions for improving system performance, bandwidth, and power consumption. Based on mature micro-system processing technology, a material extraction approach for silicon interposer applied for… read more here.
Keywords: high speed; permittivity; speed digital; silicon interposer ... See more keywords