Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors
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DOI: 10.1109/tvlsi.2016.2642587
Abstract: This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks,… read more here.
Keywords: fighting dark; silicon toward; toward realizing; dark silicon ... See more keywords