Articles with "silicon wafer" as a keyword



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DNA–RNA complementation on silicon wafer for thyroid cancer determination

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Published in 2020 at "Biotechnology and Applied Biochemistry"

DOI: 10.1002/bab.1961

Abstract: One of the current issues with thyroid tumor is early diagnosis as it makes the higher possibility of curing. This research was focused to detect and quantify the level of specific target sequence complementation of… read more here.

Keywords: silicon wafer; dna; target; complementation ... See more keywords
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Investigations of silicon wafer bonding utilizing sputtered Al and Sn films

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Published in 2017 at "Microsystem Technologies"

DOI: 10.1007/s00542-016-2982-4

Abstract: Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn… read more here.

Keywords: silicon wafer; bonding utilizing; investigations silicon; wafer bonding ... See more keywords
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Experimental Investigation for Generation of Micro-Holes on Silicon Wafer Using Electrochemical Discharge Machining Process

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Published in 2019 at "Silicon"

DOI: 10.1007/s12633-019-00273-8

Abstract: Electrochemical discharge machining (ECDM) is a versatile machining process due to its applicability to machine different materials regardless to their properties. In this work, machining behaviour of silicon wafer using ECDM is presented. An attempt… read more here.

Keywords: silicon wafer; process; micro holes; electrochemical discharge ... See more keywords
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Surface modification of silicon wafer by grafting zwitterionic polymers to improve its antifouling property

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Published in 2017 at "Applied Surface Science"

DOI: 10.1016/j.apsusc.2017.05.016

Abstract: Abstract Silicon (111) wafer was modified by triethoxyvinylsilane containing double bond as an intermedium, and then P4VP (polymer 4-vinyl pyridine) brush was “grafted” onto the surface of silicon wafer containing reactive double bonds by adopting… read more here.

Keywords: substrate; p4vp psl; silicon wafer; silicon ... See more keywords
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Temperature-dependent interface characteristic of silicon wafer bonding based on an amorphous germanium layer deposited by DC-magnetron sputtering

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Published in 2018 at "Applied Surface Science"

DOI: 10.1016/j.apsusc.2017.10.150

Abstract: Abstract We report a near-bubble-free low-temperature silicon (Si) wafer bonding with a thin amorphous Ge (a-Ge) intermediate layer. The DC-magnetron-sputtered a-Ge film on Si is demonstrated to be extremely flat (RMS = 0.28 nm) and hydrophilic (contact angle = 3°).… read more here.

Keywords: temperature; silicon wafer; layer; wafer bonding ... See more keywords
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Low emissivity double sides antireflection coatings for silicon wafer at infrared region

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Published in 2018 at "Journal of Alloys and Compounds"

DOI: 10.1016/j.jallcom.2018.01.384

Abstract: Abstract Silicon wafer, when operating from the band edge to the far infrared, inherently possess nearly polarization-independent low intrinsic loss - an appropriate infrared transmission window sheet for infrared devices. However, the incident light is… read more here.

Keywords: emissivity double; silicon wafer; silicon; low emissivity ... See more keywords
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Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw

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Published in 2021 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2021.105860

Abstract: Abstract At present, diamond multi-wire sawing technology has been applied to the slicing of polysilicon wafers. The residual microcracks on the surface and subsurface of the silicon wafer due to material brittle removal are prone… read more here.

Keywords: speed; silicon wafer; stress; coupling stress ... See more keywords
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Femtosecond laser ultrasonic inspection of a moving object and its application to estimation of silicon wafer coating thickness

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Published in 2022 at "Optics and Lasers in Engineering"

DOI: 10.1016/j.optlaseng.2021.106778

Abstract: Abstract In this study, an ultrasound generation and sensing system using a femtosecond laser is developed specifically for noncontact inspection of a moving object. In the developed femtosecond laser ultrasonic system, a laser pulse source… read more here.

Keywords: moving object; laser; silicon wafer; femtosecond laser ... See more keywords
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Estimating residual stresses of silicon wafer from measured full-field deflection distribution

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Published in 2022 at "Optics and Lasers in Engineering"

DOI: 10.1016/j.optlaseng.2021.106781

Abstract: Abstract This paper proposes an experimental-numerical hybrid method for estimating the residual stresses in a silicon wafer from the full-field deflection measurement. In the proposed method, the measured deflection distribution is approximated using regularized least-squares… read more here.

Keywords: deflection; silicon wafer; deflection distribution; method ... See more keywords
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A numerical model for soldering process in silicon solar cells

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Published in 2017 at "Solar Energy"

DOI: 10.1016/j.solener.2017.03.065

Abstract: Abstract Solar or Photovoltaic (PV) cells are utilized to convert solar energy into electricity through the photovoltaic effect. Although, Silicon solar cell is one of the most prevalent type of solar cells; manufacturing of this… read more here.

Keywords: silicon wafer; soldering process; solar cell; silicon solar ... See more keywords
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Effects of H2O2, Cu(NO3)2 and HF temperatures on surface texturization of diamond-wire-sawn multicrystalline silicon wafer

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Published in 2020 at "Solar Energy Materials and Solar Cells"

DOI: 10.1016/j.solmat.2020.110583

Abstract: Abstract Previous studies have considered the same temperature for all components of the silicon etching solution, and the effect of the temperature of the individual components on the etching results has not been explored. In… read more here.

Keywords: silicon wafer; wafer; wire sawn; effects h2o2 ... See more keywords