DNA–RNA complementation on silicon wafer for thyroid cancer determination
Sign Up to like & getrecommendations! Published in 2020 at "Biotechnology and Applied Biochemistry"
DOI: 10.1002/bab.1961
Abstract: One of the current issues with thyroid tumor is early diagnosis as it makes the higher possibility of curing. This research was focused to detect and quantify the level of specific target sequence complementation of… read more here.
Keywords: silicon wafer; dna; target; complementation ... See more keywords
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
Sign Up to like & getrecommendations! Published in 2017 at "Microsystem Technologies"
DOI: 10.1007/s00542-016-2982-4
Abstract: Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn… read more here.
Keywords: silicon wafer; bonding utilizing; investigations silicon; wafer bonding ... See more keywords
Experimental Investigation for Generation of Micro-Holes on Silicon Wafer Using Electrochemical Discharge Machining Process
Sign Up to like & getrecommendations! Published in 2019 at "Silicon"
DOI: 10.1007/s12633-019-00273-8
Abstract: Electrochemical discharge machining (ECDM) is a versatile machining process due to its applicability to machine different materials regardless to their properties. In this work, machining behaviour of silicon wafer using ECDM is presented. An attempt… read more here.
Keywords: silicon wafer; process; micro holes; electrochemical discharge ... See more keywords
Surface modification of silicon wafer by grafting zwitterionic polymers to improve its antifouling property
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2017.05.016
Abstract: Abstract Silicon (111) wafer was modified by triethoxyvinylsilane containing double bond as an intermedium, and then P4VP (polymer 4-vinyl pyridine) brush was “grafted” onto the surface of silicon wafer containing reactive double bonds by adopting… read more here.
Keywords: substrate; p4vp psl; silicon wafer; silicon ... See more keywords
Temperature-dependent interface characteristic of silicon wafer bonding based on an amorphous germanium layer deposited by DC-magnetron sputtering
Sign Up to like & getrecommendations! Published in 2018 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2017.10.150
Abstract: Abstract We report a near-bubble-free low-temperature silicon (Si) wafer bonding with a thin amorphous Ge (a-Ge) intermediate layer. The DC-magnetron-sputtered a-Ge film on Si is demonstrated to be extremely flat (RMS = 0.28 nm) and hydrophilic (contact angle = 3°).… read more here.
Keywords: temperature; silicon wafer; layer; wafer bonding ... See more keywords
Low emissivity double sides antireflection coatings for silicon wafer at infrared region
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2018.01.384
Abstract: Abstract Silicon wafer, when operating from the band edge to the far infrared, inherently possess nearly polarization-independent low intrinsic loss - an appropriate infrared transmission window sheet for infrared devices. However, the incident light is… read more here.
Keywords: emissivity double; silicon wafer; silicon; low emissivity ... See more keywords
Finite element analysis on processing stress of polysilicon cut by diamond multi-wire saw
Sign Up to like & getrecommendations! Published in 2021 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2021.105860
Abstract: Abstract At present, diamond multi-wire sawing technology has been applied to the slicing of polysilicon wafers. The residual microcracks on the surface and subsurface of the silicon wafer due to material brittle removal are prone… read more here.
Keywords: speed; silicon wafer; stress; coupling stress ... See more keywords
Femtosecond laser ultrasonic inspection of a moving object and its application to estimation of silicon wafer coating thickness
Sign Up to like & getrecommendations! Published in 2022 at "Optics and Lasers in Engineering"
DOI: 10.1016/j.optlaseng.2021.106778
Abstract: Abstract In this study, an ultrasound generation and sensing system using a femtosecond laser is developed specifically for noncontact inspection of a moving object. In the developed femtosecond laser ultrasonic system, a laser pulse source… read more here.
Keywords: moving object; laser; silicon wafer; femtosecond laser ... See more keywords
Estimating residual stresses of silicon wafer from measured full-field deflection distribution
Sign Up to like & getrecommendations! Published in 2022 at "Optics and Lasers in Engineering"
DOI: 10.1016/j.optlaseng.2021.106781
Abstract: Abstract This paper proposes an experimental-numerical hybrid method for estimating the residual stresses in a silicon wafer from the full-field deflection measurement. In the proposed method, the measured deflection distribution is approximated using regularized least-squares… read more here.
Keywords: deflection; silicon wafer; deflection distribution; method ... See more keywords
A numerical model for soldering process in silicon solar cells
Sign Up to like & getrecommendations! Published in 2017 at "Solar Energy"
DOI: 10.1016/j.solener.2017.03.065
Abstract: Abstract Solar or Photovoltaic (PV) cells are utilized to convert solar energy into electricity through the photovoltaic effect. Although, Silicon solar cell is one of the most prevalent type of solar cells; manufacturing of this… read more here.
Keywords: silicon wafer; soldering process; solar cell; silicon solar ... See more keywords
Effects of H2O2, Cu(NO3)2 and HF temperatures on surface texturization of diamond-wire-sawn multicrystalline silicon wafer
Sign Up to like & getrecommendations! Published in 2020 at "Solar Energy Materials and Solar Cells"
DOI: 10.1016/j.solmat.2020.110583
Abstract: Abstract Previous studies have considered the same temperature for all components of the silicon etching solution, and the effect of the temperature of the individual components on the etching results has not been explored. In… read more here.
Keywords: silicon wafer; wafer; wire sawn; effects h2o2 ... See more keywords