Improvement of Silver-Sintered Die Bonding of SiC/DBC Power Modules Through Backside Metallization With High-Density (111) Orientation Ag Nanotwinned Films
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DOI: 10.1109/tcpmt.2024.3380621
Abstract: Silver paste sintering is a promising die attachment technology for power electronic devices due to its high thermal and electrical conductivities, as well as superior mechanical properties. This study presents the silver-sintered die bonding of… read more here.
Keywords: die bonding; power modules; silver sintered; sintered die ... See more keywords