Simple Protein Foaming‐Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity Properties
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DOI: 10.1002/advs.202506465
Abstract: The miniaturization and high‐power density of electronic devices present new challenges for thermal management. Efficient heat dissipation in electrically insulating packaging materials is currently limited by the thermal conductivity of thermal‐interface materials (TIMs) and their… read more here.
Keywords: protein foaming; heat; simple protein; mgo ... See more keywords