Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
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DOI: 10.1109/tdmr.2018.2825386
Abstract: 13.5 mm ${\times }\,\,$ 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 °C and a pressure of 10 MPa for 5 min and compared with Pb5Sn solder joint… read more here.
Keywords: sintered nano; die attachments; power; power cycling ... See more keywords