Cantilever testing of sintered-silver interconnects
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8063-3
Abstract: Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method… read more here.
Keywords: cantilever testing; testing sintered; tensile shear; silver interconnects ... See more keywords
Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-020-08325-1
Abstract: Characterizations of equivalent thermal conductivity (ETC) of sintered silver is an important topic due to the thermal–mechanical reliability requirements of electronic packaging. In this paper, the effect of various types of cracks on the ETC… read more here.
Keywords: crack effect; etc sintered; sintered silver; crack ... See more keywords
Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2016.2628874
Abstract: Silver sintering is used to bond five components together in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out… read more here.
Keywords: temperature; bonding high; high temperature; silver bonding ... See more keywords
Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2773100
Abstract: Nanosilver paste, as a kind of new thermal interface material (TIM) with superior thermal performance, has the potential to be a replacement for the conventional TIMs, such as greases, gels, and phase-change materials. In this… read more here.
Keywords: pressure assisted; area; sintered silver; low pressure ... See more keywords
Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3032962
Abstract: Sintered silver with high thermal conductivity and reliability has been considered as a promising substrate bonding solution in power modules. The traditional double printing process is complex, and the second layer of silver paste is… read more here.
Keywords: sintered silver; printing; process; substrate bonding ... See more keywords
Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2017.2737829
Abstract: A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material… read more here.
Keywords: high power; stable sintered; power temperature; die attach ... See more keywords
Effect of Surface Roughening of Temperature-Cycled Ceramic-Metal-Bonded Substrates on Thermomechanical Reliability of Sintered-Silver Joints
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2018.2836190
Abstract: We studied the reliability of power chip die-attach by sintered-silver on two types of ceramic-metal-bonded substrates: 1) aluminum-nitride direct-bond-aluminum (DBA) and 2) active-metal-brazed (AMB) silicon nitride-copper. The samples underwent a temperature-cycling test from −55 °C… read more here.
Keywords: ceramic metal; temperature; surface; sintered silver ... See more keywords
Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test
Sign Up to like & getrecommendations! Published in 2021 at "Energies"
DOI: 10.3390/en14175532
Abstract: This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste,… read more here.
Keywords: thermal shock; mechanism; sintered silver; mechanism pressure ... See more keywords