Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure
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DOI: 10.3390/mi11030328
Abstract: In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated,… read more here.
Keywords: sintering chip; filling sintering; process; powder filling ... See more keywords