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Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2911410
Abstract: In this paper, the interconnection/transition between two popular printed circuit board (PCB) technologies, i.e., the substrate integrated suspended line (SISL) and the air-filled substrate integrated waveguide (AFSIW), is studied and designed. To obtain a smooth…
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Keywords:
afsiw transitions;
fabrication;
sisl afsiw;
fabrication tolerance ... See more keywords