Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes
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DOI: 10.1109/tcpmt.2020.2975571
Abstract: A six-side molded wafer-level chip scale package (mWLCSP) is a novel and attractive packaging method for smart phone applications due to its lower cost, better electrical performance, and higher long-term reliability. Nevertheless, wafer warpage in… read more here.
Keywords: control; packaging processes; warpage; six side ... See more keywords