Effects of location and size of Kirkendall voids on mechanical response of Cu/Sn solder joint under tension
Sign Up to like & getrecommendations! Published in 2023 at "Molecular Simulation"
DOI: 10.1080/08927022.2023.2202754
Abstract: ABSTRACT The effects of the location and size of Kirkendall voids at the nanoscale on the mechanical response of a Cu/Sn solder joint under a tension test are studied using molecular dynamics simulations. The simulation… read more here.
Keywords: solder; location size; effects location; kirkendall voids ... See more keywords