Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging
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DOI: 10.1007/s10854-017-8315-2
Abstract: Bonding technology using a Ag nanoparticle paste has been a promising substitute for high-Pb-containing solder joining. However, it has some drawbacks, such as high cost and low compatibility, due to its high sintering temperature. Recently,… read more here.
Keywords: strength; temperature; sized particle; paste ... See more keywords