Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9684-x
Abstract: This work studied the additions of nano-Cu6Sn5 intermetallic particles into a lead-free Sn3.0Ag0.5Cu (SAC305) solder alloy with content ranging from 0.05 to 2 wt%. The thermal behavior, mechanical properties and interfacial reaction of Cu6Sn5 nanoparticle containing… read more here.
Keywords: nanoparticles addition; thermal behavior; sn3 0ag0; solder ... See more keywords
The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-06907-8
Abstract: The growth behavior of intermetallic compound (IMC) in single crystal Sn3.0Ag0.5Cu (SAC305) and Sn3.0Ag3.0Bi3.0In (SABI333) ball grid array solder joints with Au/Ni/Cu pads under 104 A/cm2 current stressing was investigated. Characterization by scanning electron microscopy and… read more here.
Keywords: current stressing; solder joints; single crystal; crystal sn3 ... See more keywords
Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Manufacturing Processes"
DOI: 10.1016/j.jmapro.2021.02.003
Abstract: Abstract Cu-foam sheets with the thicknesses of 0.15 mm and 0.5 mm were utilized as strengthening structure to improve the performances of the Sn3.0Ag0.5Cu (SAC305)/Cu solder joints. The ultrasonic-assisted soldering was applied to manufacture the… read more here.
Keywords: solder joints; foam; sn3 0ag0; solder ... See more keywords