Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint
Sign Up to like & getrecommendations! Published in 2024 at "Metals"
DOI: 10.3390/met14121420
Abstract: A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity… read more here.
Keywords: sn58bi composite; solder joint; solder; thermomigration microstructure ... See more keywords