Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging
Sign Up to like & getrecommendations! Published in 2019 at "Materials Letters"
DOI: 10.1016/j.matlet.2019.01.056
Abstract: Abstract The brittle Sn58Bi solder was modified with the ductile copper foam (Cu-F) with high plasticity to improve its mechanical properties. It is observed that the coarse microstructure of Sn58Bi solder is notably refined by… read more here.
Keywords: solder; copper foam; sn58bi solder; sn58bi soldered ... See more keywords
Piezoelectric Ceramics and Flexible Printed Circuits’ Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2907927
Abstract: Interconnection technology using Sn58Bi solder anisotropic conductive films (ACFs) has been chosen to assemble piezoelectric ceramics on flexible printed circuits for ultrasound imaging applications. The bonding and dicing processes were performed, and the bending of… read more here.
Keywords: solder anisotropic; anisotropic conductive; using sn58bi; conductive films ... See more keywords