SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
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DOI: 10.1002/adem.202401366
Abstract: An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more… read more here.
Keywords: flux; solder joint; solder; snagcu solder ... See more keywords