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Published in 2020 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-020-08595-9
Abstract: Ag (2.0 wt.%) and In (1.5 wt.%) were alloyed into Sn-58Bi eutectic solder, and the individual and combined influences of Ag and In on the microstructure, microhardness, and impact toughness of the SnBi solder were investigated. The…
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Keywords:
snbiagin;
snbi solder;
solder;
eutectic solder ... See more keywords