Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)
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DOI: 10.1088/1361-6528/ac96f8
Abstract: Nanotwinned copper is a potential microelectronic interconnection material due to its superior strength and conductivity, however, its filling ability is urgently needed to improve before its application in the field of advanced packaging. The effect… read more here.
Keywords: copper; thiazolinyl dithiopropane; sodium thiazolinyl; copper films ... See more keywords