SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
Sign Up to like & getrecommendations! Published in 2024 at "Advanced Engineering Materials"
DOI: 10.1002/adem.202401366
Abstract: An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more… read more here.
Keywords: flux; solder joint; solder; snagcu solder ... See more keywords
Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and Nanoindentation Studies
Sign Up to like & getrecommendations! Published in 2024 at "Advanced Engineering Materials"
DOI: 10.1002/adem.202401703
Abstract: Two different types of lead‐free solder joints Cu/(Sn3.0Ag0.5Cu)/Cu and Cu/Sn/(Sn3.0Ag0.5Cu)/Sn/Cu have been investigated. Joints are produced following the transient liquid phase like soldering process. The microstructure of different intermetallic compounds (IMCs) present at the joint… read more here.
Keywords: joint interface; stress; solder joint; solder ... See more keywords
Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants
Sign Up to like & getrecommendations! Published in 2018 at "International Journal of Thermophysics"
DOI: 10.1007/s10765-018-2397-9
Abstract: AbstractWith the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn–3Ag–0.5Cu–xP solder alloys, with various drop sizes as well as different phosphorus (P) content,… read more here.
Keywords: dorsey method; containing surfactants; solder; surface tension ... See more keywords
Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6347-2
Abstract: In this paper, the grain orientation evolution of Pb-free solder joints during thermomechanical fatigue (TMF) was characterized quantitatively using in-situ electron backscattered diffraction (EBSD) observation, which was an effective way to clarify the mechanism of… read more here.
Keywords: grain orientation; solder joints; stress; solder ... See more keywords
Study on the microstructure and properties of low-Ag Sn–0.3Ag–0.7Cu–0.5Ga solder alloys bearing Pr
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6537-y
Abstract: Effect of Pr element on the wettability, microstructure, interface morphology and mechanical property of Sn–0.3Ag–0.7Cu–0.5Ga–xPr solder has been studied. The result exhibits that the wettability of solders could significantly be improved by adding an approximate… read more here.
Keywords: 7cu 5ga; study microstructure; 3ag 7cu; microstructure properties ... See more keywords
A superior interfacial reliability of Fe–Ni UBM during high temperature storage
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6576-4
Abstract: Ball shear test was conducted on the SnAgCu/Fe–Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 °C high temperature storage following the industrial JEDEC standards. According to microstructural observation, Fe–Ni UBMs show… read more here.
Keywords: storage; fracture; high temperature; solder ... See more keywords
Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7360-1
Abstract: Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for… read more here.
Keywords: tensile strength; temperature; 0ag 5cu; solder joints ... See more keywords
Interfacial reactions between Cu and Zn20Sn solder doped with minor RE
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7647-2
Abstract: The interfacial microstructures between Zn–Sn solder alloys and Cu substrate were investigated, and the effect of rare earth (RE) elements on the interfacial microstructures between Zn–Sn solder alloys and Cu substrate were also studied. The… read more here.
Keywords: interfacial reactions; reactions zn20sn; solder; zn20sn solder ... See more keywords
Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0021-1
Abstract: A reduction of the particle size used in solder pastes was shown to affect the electrical and mechanical properties of finely printed solder bumps. Sn–3.0Ag–0.5Cu solder nanoparticles were synthesized using a radio frequency thermal plasma… read more here.
Keywords: particle size; printed solder; reverse offset; solder bumps ... See more keywords
Enhancement on the high-temperature joint reliability and corrosion resistance of Sn–0.3Ag–0.7Cu low-Ag solder contributed by Al2O3 Nanoparticles (0.12 wt%)
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0092-z
Abstract: In this study, the evolution of interfacial microstructures and mechanical properties of the joints soldered with Sn–0.3Ag–0.7Cu (SAC0307) and SAC0307-0.12Al2O3 nanoparticles (NPs) aged at 150 °C for different hours (72–840 h) were investigated. It was found the… read more here.
Keywords: temperature joint; joint reliability; high temperature; corrosion ... See more keywords
Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0492-0
Abstract: This paper presents the influence of aging temperature as well as ZnO nanoparticles addition on the properties of Sn–0.7Cu solder. A series of Sn–0.7Cu–ZnO composite solders with ZnO nanoparticles traces (0, 0.1, 0.25, 0.5 and… read more here.
Keywords: evolution tensile; tensile creep; microstructure evolution; solder ... See more keywords