Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03506-4
Abstract: Preventing columnar β-Sn grains forming during manufacture have undoubtedly become major challenges. Columnar grains are commonly considered as unfavorable as their existence can relocate defects of solidification and deterioration in mechanical properties; however, the practical… read more here.
Keywords: solder alloy; pms; alloy; pulse echo ... See more keywords
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys
Sign Up to like & getrecommendations! Published in 2019 at "International Journal of Materials Research"
DOI: 10.3139/146.111851
Abstract: Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys.… read more here.
Keywords: solder alloy; melting point; solder; eutectic solder ... See more keywords
Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model
Sign Up to like & getrecommendations! Published in 2021 at "Materials"
DOI: 10.3390/ma14092335
Abstract: The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The… read more here.
Keywords: alloys designed; solder alloy; model; solder ... See more keywords