High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-6412-x
Abstract: In this paper, the impact performance of the novel Fe and Bi added Sn-1Ag-0.5Cu solders has been thoroughly evaluated under severe thermal aging at 200 °C temperature for 100, 200 and 300 h. Impact absorbed energy was… read more here.
Keywords: microscopy; impact; 1ag 5cu; solder alloys ... See more keywords
Interfacial reactions between Cu and Zn20Sn solder doped with minor RE
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7647-2
Abstract: The interfacial microstructures between Zn–Sn solder alloys and Cu substrate were investigated, and the effect of rare earth (RE) elements on the interfacial microstructures between Zn–Sn solder alloys and Cu substrate were also studied. The… read more here.
Keywords: interfacial reactions; reactions zn20sn; solder; zn20sn solder ... See more keywords
Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Engineering and Performance"
DOI: 10.1007/s11665-018-3734-7
Abstract: The addition of Ni on lead-free solder alloys Sn0.7Cu was tested in this study. A small amount of Ni was added to the solder alloys to evaluate the thermal behavior, microstructure, and mechanical properties of… read more here.
Keywords: 7cu solder; addition; solder; solder alloys ... See more keywords
A micromechanical analysis to the elasto-viscoplastic behavior of solder alloys
Sign Up to like & getrecommendations! Published in 2019 at "International Journal of Solids and Structures"
DOI: 10.1016/j.ijsolstr.2018.10.003
Abstract: Abstract A small strain multi-scale elasto-plastic self-consistent constitutive model is developed to describe the rate and temperature dependent behavior of solder alloys. In the extended model, a modified Voce hardening law is proposed to describe… read more here.
Keywords: solder alloys; behavior solder; model; behavior ... See more keywords
Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities
Sign Up to like & getrecommendations! Published in 2018 at "Philosophical Magazine"
DOI: 10.1080/14786435.2018.1537530
Abstract: ABSTRACT Because of the increasing complexity and cost of experiments carried out, the data for the multi-component alloy systems have frequently been obtained by numerical modelling. It is clear that the related calculations require reliable… read more here.
Keywords: description viscosity; viscosity; solder; solder alloys ... See more keywords
An investigation of influencing of Sb and Bi contents on surface tensions associated with Pb-free Sn-Zn-Sb-Bi quaternary and sub-quaternary solder alloys
Sign Up to like & getrecommendations! Published in 2019 at "Philosophical Magazine"
DOI: 10.1080/14786435.2019.1605215
Abstract: ABSTRACT The surface tensions of ternary and quaternary systems of Sn-based Pb-free solder alloys have been calculated using geometric models, such as Muggianu, Kohler, Chou’s general solution model (GSM), Toop, Guggenheim, ideal Butler and Butler… read more here.
Keywords: influencing contents; contents surface; investigation influencing; surface tensions ... See more keywords
Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
Sign Up to like & getrecommendations! Published in 2020 at "Advances in Materials Science and Engineering"
DOI: 10.1155/2020/4969647
Abstract: With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials.… read more here.
Keywords: novel based; packaging; solder; solder alloys ... See more keywords
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Nanomaterials"
DOI: 10.1155/2020/8843166
Abstract: With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the… read more here.
Keywords: lead free; composite solder; based lead; solder ... See more keywords
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys
Sign Up to like & getrecommendations! Published in 2019 at "International Journal of Materials Research"
DOI: 10.3139/146.111851
Abstract: Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys.… read more here.
Keywords: solder alloy; melting point; solder; eutectic solder ... See more keywords
Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys
Sign Up to like & getrecommendations! Published in 2019 at "Materials"
DOI: 10.3390/ma12071194
Abstract: This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy… read more here.
Keywords: solder alloys; effect aluminum; solder; microstructure ... See more keywords
Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model
Sign Up to like & getrecommendations! Published in 2021 at "Materials"
DOI: 10.3390/ma14092335
Abstract: The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The… read more here.
Keywords: alloys designed; solder alloy; model; solder ... See more keywords