A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
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DOI: 10.3390/mi13060867
Abstract: We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is… read more here.
Keywords: solder; low temperature; eutectic solder; solder assembly ... See more keywords