Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0021-1
Abstract: A reduction of the particle size used in solder pastes was shown to affect the electrical and mechanical properties of finely printed solder bumps. Sn–3.0Ag–0.5Cu solder nanoparticles were synthesized using a radio frequency thermal plasma… read more here.
Keywords: particle size; printed solder; reverse offset; solder bumps ... See more keywords
Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13060953
Abstract: The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density. The electromigration of solder joints under… read more here.
Keywords: induced failure; solder; ubm layer; solder bumps ... See more keywords