A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging
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DOI: 10.1016/j.ijheatmasstransfer.2020.119585
Abstract: Abstract The 3D problem of spreading and solidification of a molten solder droplet (with a melting temperature of Tm and a radius of Rd) on a circular pillar (with a radius Rpillar and a height… read more here.
Keywords: temperature; contact angle; droplet; molten solder ... See more keywords