Effect of zinc particle mixing on properties of copper–nanoparticle/bismuth–tin solder hybrid joints
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DOI: 10.1007/s10854-018-0175-x
Abstract: The effects of Zn particle mixing into a Cu–nanoparticle/Bi–Sn solder hybrid bonding were examined. The bonding strength of an SiC/direct-bonded-copper joint exhibited limited dependence on the Zn mixing ratio, whereas that of an SiC/Cu joint… read more here.
Keywords: strength; bonding strength; nanoparticle; mixing ratio ... See more keywords