Accelerated mechanical low cycle fatigue in isothermal solder interconnects
Sign Up to like & getrecommendations! Published in 2021 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2020.113998
Abstract: Abstract Properly assessing the underlying physics of failure is critical in predicting the long term reliability of electronic packages in their intended field applications, yet traditional reliability demonstration methods are complicated by time and cost… read more here.
Keywords: fatigue; mechanical low; solder interconnects; solder ... See more keywords
Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2025.3574560
Abstract: With the increasing demand for emerging technologies like artificial intelligence and big data, the significance of advanced chip integration and packaging has grown considerably. Sn-Bi based solders have gained significant attention and have been explored… read more here.
Keywords: coarsening inhomogeneous; phase coarsening; solder interconnects; phase ... See more keywords