Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5344-9
Abstract: The effects of micro solder joint geometry on intermetallic compound (IMC) growth and electromigration during thermal aging and current stressing have been investigated using three groups of specimens: sandwich structure with solder layer of 10 μm… read more here.
Keywords: micro solder; solder joint; geometry; solder ... See more keywords
Generation of near eutectic phase layer in Sn-15Bi solder joint during electro-migration
Sign Up to like & getrecommendations! Published in 2017 at "Materials Letters"
DOI: 10.1016/j.matlet.2016.12.065
Abstract: Abstract The electro-migration test of Sn-15Bi solder joint was conducted at 150 °C with a current density of 160 A/cm 2 . The near eutectic phase layer thickening as the extending of electro-migration time was observed on… read more here.
Keywords: near eutectic; phase; 15bi solder; solder joint ... See more keywords
Effects of location and size of Kirkendall voids on mechanical response of Cu/Sn solder joint under tension
Sign Up to like & getrecommendations! Published in 2023 at "Molecular Simulation"
DOI: 10.1080/08927022.2023.2202754
Abstract: ABSTRACT The effects of the location and size of Kirkendall voids at the nanoscale on the mechanical response of a Cu/Sn solder joint under a tension test are studied using molecular dynamics simulations. The simulation… read more here.
Keywords: solder; location size; effects location; kirkendall voids ... See more keywords
High-Tolerance Thin-Film Solder Joints for Electrical Interconnection in Harsh Environments
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Sensors Journal"
DOI: 10.1109/jsen.2023.3268298
Abstract: This article presents a pioneering use of thin-film solder joint in the electrical interconnection of high-temperature thin-film sensors (TFSs), which aims to improve the low tolerance of traditional soldered balls in extreme environments. The structure… read more here.
Keywords: thin film; solder; film solder; solder joint ... See more keywords
Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2016.2641040
Abstract: In this paper, wafer-level preapplied nonconductive films (NCFs) were used to interconnect the Cu pillar/Sn-Ag microbumps for 3-D through silicon via vertical interconnection. Thermocompression bonding is a common method to interconnect chips to substrates using… read more here.
Keywords: isothermal bonding; solder joint; joint; bonding parameters ... See more keywords
Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2696159
Abstract: Solder joint provides electronic and mechanical connections between components and substrate. Overheating and excessive temperature gradient can cause solder joint failures and then make the whole system break down. Thus, thermal analysis has been the… read more here.
Keywords: solder joint; thermal analysis; solder; eddy current ... See more keywords
SMT Solder Joint Inspection via a Novel Cascaded Convolutional Neural Network
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2789453
Abstract: Due to the excellent self-learning ability of deep learning, we propose a novel deep-learning-based method to inspect surface-mount technology (SMT) solder joints in this paper. In contrast to the state-of-the-art learning-based methods in which low-level… read more here.
Keywords: smt solder; novel cascaded; network; solder joint ... See more keywords
Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2795347
Abstract: Reliability of conventional electronic assemblies in real service applications is typically limited by fatigue failure of a single solder joint in reversed cyclic loading. Fatigue damage accumulation in a lead-free solder joint is still not… read more here.
Keywords: work; amplitude; solder joint; solder ... See more keywords
Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2018.2861777
Abstract: This paper demonstrates to what extent the number of thermal cycles affects the mechanical properties as well as the thermal conductivity of a porous solder joint in an insulated-gate bipolar transistor discrete. The blind mode… read more here.
Keywords: solder joint; conductivity porous; thermal conductivity; mechanical properties ... See more keywords
Solder Joint Recognition Using Mask R-CNN Method
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2019.2952393
Abstract: This article proposes a novel solder joint recognition method based on the state-of-the-art Mask Region-convolutional neural network (R-CNN) deep learning method. Traditional classification methods, such as neural networks and statistical methods, can only classify defect… read more here.
Keywords: solder joint; recognition; method; cnn ... See more keywords
Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Instrumentation and Measurement"
DOI: 10.1109/tim.2023.3277935
Abstract: Surface mount technology (SMT) is a procedure for mounting electronic components to the surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than the conventional through-hole mounting, many errors may occur… read more here.
Keywords: circuit boards; inspection; printed circuit; joint inspection ... See more keywords