Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress
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DOI: 10.1007/s10854-017-6347-2
Abstract: In this paper, the grain orientation evolution of Pb-free solder joints during thermomechanical fatigue (TMF) was characterized quantitatively using in-situ electron backscattered diffraction (EBSD) observation, which was an effective way to clarify the mechanism of… read more here.
Keywords: grain orientation; solder joints; stress; solder ... See more keywords
Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints
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DOI: 10.1007/s10854-017-7360-1
Abstract: Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for… read more here.
Keywords: tensile strength; temperature; 0ag 5cu; solder joints ... See more keywords
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0506-y
Abstract: Electromigration (EM) is the mass transport of atoms due to electron flow, which induces a disconnect in electronic packaging. Recently, EM has received growing attention because it occurs easily when the size of joints in… read more here.
Keywords: graphene oxide; solder joints; electromigration; lifetime ... See more keywords
Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02206-y
Abstract: In this study, the Ag and In were alloyed to the Sn-58Bi solder, and their individual and combined influences on the SnBi solder and the SnBi/Cu solder joints were investigated. The results indicate that the… read more here.
Keywords: aged snbi; solder joints; snbi solder; solder ... See more keywords
Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package
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DOI: 10.1007/s10854-019-02655-5
Abstract: In soldering process, oxygen trapped in solder often leads to reliability issues. In order to determine basic mechanisms, five commercial Au-20Sn solder preforms with different oxygen content were studied. The XPS results revealed that the… read more here.
Keywords: oxygen; solder joints; 20sn solder; solder ... See more keywords
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02764-1
Abstract: An accelerator, 3-(2-benzothiazolylthio)-1-propanesulfonsäure (ZPS), and a suppressor, polyethylene glycol (PEG), were employed and formulated with chloride ions (Cl − ) in plating solution containing electrolytes (CuSO 4 and H 2 SO 4 ) to prepare… read more here.
Keywords: microscopy; solder joints; zps; electron ... See more keywords
Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-04543-9
Abstract: To enhance the effects of electroless Ni–P plating on inhibiting atom diffusion in Sn-58Bi joint systems, adding nano-sized metals into coating was regarded as an efficient method. Therefore, Cu nanoparticles were chosen as the additive… read more here.
Keywords: interfacial microstructure; evolution solder; solder joints; electroless plating ... See more keywords
Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding
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DOI: 10.1007/s10854-020-04824-3
Abstract: For the advanced 3D-IC or 3D-packaging application, Cu-core solder joint is already a high reliability option for high power device and 3D packaging. However, with the harsher requirement for mechanical and electromigration reliability, it is… read more here.
Keywords: strength; increasing mechanical; solder joints; solder ... See more keywords
Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep
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DOI: 10.1007/s11340-017-0258-2
Abstract: In this paper, the mechanical properties and creep behavior of lead-free solder joints has been characterized by nano-mechanical testing of single grain SAC305 solder joints extracted from plastic ball grid array (PBGA) assemblies. The anisotropic… read more here.
Keywords: using nanoindentation; solder joints; anisotropic mechanical; mechanical properties ... See more keywords
Study on the Tensile Creep Behavior of Carbon Nanotubes-Reinforced Sn-58Bi Solder Joints
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DOI: 10.1007/s11664-017-5741-0
Abstract: The microstructure and tensile creep behavior of plain Sn-58Bi solder and carbon nanotubes (CNTs)-reinforced composite solder joints were investigated. The stress exponent n under different stresses and the creep activation energy Qc under different temperatures… read more here.
Keywords: creep behavior; composite solder; solder joints; tensile creep ... See more keywords
The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing
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DOI: 10.1007/s11664-018-06907-8
Abstract: The growth behavior of intermetallic compound (IMC) in single crystal Sn3.0Ag0.5Cu (SAC305) and Sn3.0Ag3.0Bi3.0In (SABI333) ball grid array solder joints with Au/Ni/Cu pads under 104 A/cm2 current stressing was investigated. Characterization by scanning electron microscopy and… read more here.
Keywords: current stressing; solder joints; single crystal; crystal sn3 ... See more keywords