An Improved Cauer Model of IGBT Module: Inclusive Void Fraction in Solder Layer
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3010064
Abstract: The void in the solder layer is one of the most important aging forms of the insulated-gate bipolar transistor (IGBT) module. In this article, the influence mechanism of different void fractions on the thermal conductivity… read more here.
Keywords: improved cauer; layer; cauer model; solder layer ... See more keywords
Monitoring Void Fatigue in Solder Layer of IGBT Module Based on Common Mode Interference Spectrum
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3342617
Abstract: Solder voids are one of the most important aging forms of insulated gate bipolar transistor (IGBT) modules. This article presents an online monitoring method of void fatigue in the solder layer of an IGBT module… read more here.
Keywords: igbt module; solder; solder layer;
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3447124
Abstract: The double-sided cooling (DSC) module introduces greater thermomechanical stress compared to single-sided cooling (SSC) modules, posing a significant threat to reliability. The manufacturing process is complex, requiring multiple sintering or reflow operations. Due to gravitational… read more here.
Keywords: sided cooling; double sided; solder; layer tilt ... See more keywords
In-Situ Monitoring Solder Layer Degradation in Multichip IGBT Power Modules Using Auxiliary Emitter Voltage
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2024.3412918
Abstract: Asymmetric chip placement and initial die-attach defects within a multichip IGBT power module (MIPM) can cause uneven junction temperature distribution and further accelerate the solder layer degradation. This is one of the main factors which… read more here.
Keywords: multichip igbt; power; degradation; solder layer ... See more keywords
Investigation on Creep-Fatigue Interaction Failure of Die-Attach Solder Layers in IGBTs Under Power Cycling
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2025.3530991
Abstract: Creep plays a significant role in the deterioration of solder layers particularly over extended periods of heating, even though numerous existing studies focused on the mechanism of fatigue failure. In this article, the creep-fatigue interaction… read more here.
Keywords: creep; fatigue; solder; solder layer ... See more keywords
Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16093504
Abstract: The insulated-gate bipolar transistor (IGBT) represents a crucial component within the domain of power semiconductor devices, which finds ubiquitous employment across a range of critical domains, including new energy vehicles, smart grid systems, rail transit,… read more here.
Keywords: solder layer; igbt module; heat; solder ... See more keywords
Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications
Sign Up to like & getrecommendations! Published in 2025 at "Micromachines"
DOI: 10.3390/mi16070746
Abstract: High-power laser diodes (HPLDs) are increasingly used in space applications, yet solder layer (SL) reliability critically limits their performance and lifespan. This study employs finite element analysis to evaluate SL failure mechanisms in microchannel-cooled HPLDs… read more here.
Keywords: layer reliability; thermal cycling; solder layer; vibration ... See more keywords
Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules
Sign Up to like & getrecommendations! Published in 2025 at "Micromachines"
DOI: 10.3390/mi16091023
Abstract: IGBT high-power devices are subjected to various extreme working conditions for long periods and are affected by multiple loading conditions, inevitably leading to various aging and failure issues. Among them, the solder layer, as one… read more here.
Keywords: structure; parameters igbt; igbt modules; solder layer ... See more keywords