Annealing effect to constitutive behavior of Sn–3.0Ag–0.5Cu solder
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DOI: 10.1007/s10854-018-8705-0
Abstract: Sn–Ag–Cu based solder alloys are replacing Sn–Pb solders in electronic packaging structures of commercial electric devices. In order to evaluate the structural reliability, the mechanical property of solder material is critical to the numerical simulations.… read more here.
Keywords: annealing process; 0ag 5cu; solder material; annealing effect ... See more keywords