Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates
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DOI: 10.1007/s11664-018-6434-z
Abstract: In 3D electronic packages, stacked dies are connected vertically using through-silicon vias and solder micro-bumps, which are typically between 1 μm and 50 μm thick. Solder micro-joints undergo significant shear deformation due to various loading conditions, which… read more here.
Keywords: solder micro; deformation; cu6sn5 cu3sn; shear deformation ... See more keywords