Simple, low‐cost fabrication of semi‐circular channel using the surface tension of solder paste and its application to microfluidic valves
Sign Up to like & getrecommendations! Published in 2018 at "ELECTROPHORESIS"
DOI: 10.1002/elps.201800064
Abstract: This work presents a simple, low‐cost method to fabricate semi‐circular channels using solder paste, which can amalgamate the cooper surface to form a half‐cylinder mold using the surface tension of Sn–Pd alloy (the main component… read more here.
Keywords: simple low; solder paste; surface; semi circular ... See more keywords
Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-06865-1
Abstract: Eutectic Sn58Bi (SnBi) solder paste mixed with 0 wt.%, 3 wt.%, 5 wt.%, 8 wt.% and 15 wt.% of Sn-3.0Ag-0.5Cu (SAC) paste was prepared by mechanical mixing. The effects of SAC paste additions on the microstructure evolution of SnBi-SAC/Cu composite… read more here.
Keywords: 0ag 5cu; solder paste; paste; sac ... See more keywords
Optimization of Solder Volume in Printed Circuit Board Assembly Through an Operating Window Experiment—A Case Study
Sign Up to like & getrecommendations! Published in 2017 at "Experimental Techniques"
DOI: 10.1007/s40799-017-0168-3
Abstract: Controlling solder paste volume significantly influences printed circuit board bonding. Applying an improper amount of solder paste during the printing process can cause circuit issues, such as an incomplete circuit with insufficient paste and short… read more here.
Keywords: volume; solder paste; paste; operating window ... See more keywords
High-accuracy three-dimensional shape measurement of micro solder paste and printed circuits based on digital image correlation
Sign Up to like & getrecommendations! Published in 2018 at "Optical Engineering"
DOI: 10.1117/1.oe.57.5.054101
Abstract: Abstract. There is an urgent demand for high-accuracy, real-time three-dimensional (3-D) shape measurements in industrial production as an ideal tool for quality control. Based on 3-D digital image correlation (3D-DIC), in this study, we measured… read more here.
Keywords: shape; solder paste; printed circuits; accuracy ... See more keywords
Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
Sign Up to like & getrecommendations! Published in 2019 at "Nanomaterials"
DOI: 10.3390/nano9101478
Abstract: In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The… read more here.
Keywords: joint strength; solder paste; reinforced solder; paste ... See more keywords