Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate
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DOI: 10.1016/j.matchar.2017.01.004
Abstract: Abstract Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag… read more here.
Keywords: solid state; addition solid; effects addition; growth ... See more keywords