Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5883-0
Abstract: The effects of solder volume and reaction time between molten solder and a metal pad at the peak temperature of reflow on the self-alignment effect have been investigated in flip chip bonding. A glass die… read more here.
Keywords: effects solder; volume; solder volume; pad ... See more keywords
Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints
Sign Up to like & getrecommendations! Published in 2022 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2021.125307
Abstract: Abstract High-density interconnection technology is critical for semiconductor packages, which require high speed and multifunctional demands. The shrinkage of solder volume is needed for the miniaturization of devices. Fewer studies investigate using Cu3Sn than Cu6Sn5… read more here.
Keywords: solder volume; cu3sn; type cu3sn; porous type ... See more keywords