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Published in 2018 at "Materials"
DOI: 10.3390/ma11010084
Abstract: In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms…
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Keywords:
soldered sac305;
imc;
isothermal aging;
aging time ... See more keywords