Articles with "soldered sac305" as a keyword



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Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

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Published in 2018 at "Materials"

DOI: 10.3390/ma11010084

Abstract: In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms… read more here.

Keywords: soldered sac305; imc; isothermal aging; aging time ... See more keywords