Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder
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DOI: 10.1016/j.jallcom.2019.02.257
Abstract: Abstract A new coupling technique for glass-metal joining was presented in this paper. Firstly, the glass and Al were successfully bonded by anodic bonding process, then the joining between Al and Cu was achieved by… read more here.
Keywords: time; anodic bonding; solder; interface ... See more keywords