Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
Sign Up to like & getrecommendations! Published in 2017 at "Materials Letters"
DOI: 10.1016/j.matlet.2016.10.017
Abstract: Abstract The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always… read more here.
Keywords: phase; cu3sn; soldering process; ultrasonic assisted ... See more keywords
A numerical model for soldering process in silicon solar cells
Sign Up to like & getrecommendations! Published in 2017 at "Solar Energy"
DOI: 10.1016/j.solener.2017.03.065
Abstract: Abstract Solar or Photovoltaic (PV) cells are utilized to convert solar energy into electricity through the photovoltaic effect. Although, Silicon solar cell is one of the most prevalent type of solar cells; manufacturing of this… read more here.
Keywords: silicon wafer; soldering process; solar cell; silicon solar ... See more keywords
Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.
Sign Up to like & getrecommendations! Published in 2018 at "Ultrasonics sonochemistry"
DOI: 10.1016/j.ultsonch.2017.12.005
Abstract: Homogeneous (Cu, Ni)6Sn5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu… read more here.
Keywords: homogeneous 6sn5; 6sn5 intermetallic; system; ultrasound induced ... See more keywords
Transient Thermal-Electric Simulation and Experiment of Heat Transfer in Welding Tip for Reflow Soldering Process
Sign Up to like & getrecommendations! Published in 2018 at "Mathematical Problems in Engineering"
DOI: 10.1155/2018/4539054
Abstract: Welding tip is an appliance for making footprint to connect the arm and head gimbal assembly (HGA) together in reflow soldering process. The welding tip is made from 3 materials: copper alloy, stainless steel, and… read more here.
Keywords: transient thermal; soldering process; reflow soldering; simulation ... See more keywords